T 1169/97 of 03.06.2002
- European Case Law Identifier
- ECLI:EP:BA:2002:T116997.20020603
- Date of decision
- 3 June 2002
- Case number
- T 1169/97
- Online on
- 26 June 2002
- Petition for review of
- -
- Application number
- 92300687.8
- IPC class
- H01L 21/90
- Language of proceedings
- English
- Distribution
- Distributed to board chairmen (C)
- Download
- Decision in English
- OJ versions
- No OJ links found
- Other decisions for this case
- -
- Abstracts for this decision
- -
- Application title
- Method of manufacturing via holes for multilayer interconnection of semiconductor devices
- Applicant name
- FUJITSU LIMITED
- Opponent name
- -
- Board
- 3.4.03
- Headnote
- -
- Relevant legal provisions
- European Patent Convention Art 56 1973
- Keywords
- Inventive step (yes)
- Catchword
- -
- Cited cases
- -
- Citing cases
- -
ORDER
For these reasons it is decided that:
1. The decision under appeal is set aside.
2. The case is remitted to the department of the first instance with the order to grant a patent on the basis of the following documents:
Claims: 1 to 5 filed on 8 May 2002 with the letter dated 7 May 2002 6. to 8 filed on 25 November 1997 with the letter dated 21 November 1997
Description: pages 1, 2 and 6 to 17 as originally filed pages 3 and 5 filed on 26 May 1995 with the letter dated 23 May 1995 page 4 filed on 8 May 2002 with the letter dated 7 May 2002
Drawings: Sheets 1/8 to 8/8 as originally filed