T 1187/01 of 28.05.2004
- European Case Law Identifier
- ECLI:EP:BA:2004:T118701.20040528
- Date of decision
- 28 May 2004
- Case number
- T 1187/01
- Online on
- 15 July 2004
- Petition for review of
- -
- Application number
- 92101021.1
- IPC class
- H01L 23/528
- Language of proceedings
- English
- Distribution
- No distribution (D)
- Download
- Decision in English
- OJ versions
- No OJ links found
- Other decisions for this case
- -
- Abstracts for this decision
- -
- Application title
- Resin sealed semiconductor integrated circuit comprising a wiring layer
- Applicant name
- NEC CORPORATION, et al
- Opponent name
- -
- Board
- 3.4.03
- Headnote
- -
- Relevant legal provisions
- European Patent Convention Art 84 1973European Patent Convention Art 123(2) 1973
- Keywords
- Main request (clarity: yes)
- Catchword
- -
- Cited cases
- -
- Citing cases
- -
ORDER
For these reasons it is decided that:
1. The decision under appeal is set aside.
2. The case is remitted to the first instance with the order to grant a patent with the following documents:
Claims: No. 1 to 4 of the main request filed during the oral proceedings of 28 May 2004.
Description: pages 3, 8 to 10, as originally filed
pages 1, 2, 4, 5, 5a, 6 and 12, as filed with the letter of 26 May 2000,
pages 7, 11 and 13, as filed during the oral proceedings of 28 May 2004.
Figures: 1A, 1B, 2 and 3, as originally filed.