T 0927/02 of 12.07.2004
- European Case Law Identifier
- ECLI:EP:BA:2004:T092702.20040712
- Date of decision
- 12 July 2004
- Case number
- T 0927/02
- Online on
- 22 July 2004
- Petition for review of
- -
- Application number
- 97300463.3
- IPC class
- H01L 21/304
- Language of proceedings
- English
- Distribution
- Distributed to board chairmen (C)
- Download
- Decision in English
- OJ versions
- No OJ links found
- Other decisions for this case
- -
- Abstracts for this decision
- -
- Application title
- Backing pad and method for polishing semiconductor wafer therewith
- Applicant name
- SHIN-ETSU HANDOTAI COMPANY LIMITED
- Opponent name
- -
- Board
- 3.4.03
- Headnote
- -
- Relevant legal provisions
- European Patent Convention Art 54 1973European Patent Convention Art 56 1973European Patent Convention Art 123(2) 1973
- Keywords
- Inventive step (yes)
Amended subject-matter basis in the application as filed - (yes) - Catchword
- -
- Cited cases
- -
- Citing cases
- -
ORDER
For these reasons it is decided that:
1. The decision under appeal is set aside.
2. The case is remitted to the department of the first instance with the order to grant a patent with the following documents:
Claims 1 to 8 filed on 9 June 2004 with the letter dated 3 June 2004
Description
pages 1 to 3 and 6 to 12 as originally filed
pages 4, 4A and 5 filed on 9 June 2004 with the letter dated 3 June 2004
Drawings Sheets 1/2 to 2/2 as originally filed