T 0873/09 of 10.10.2013
- European Case Law Identifier
- ECLI:EP:BA:2013:T087309.20131010
- Date of decision
- 10 October 2013
- Case number
- T 0873/09
- Online on
- 15 October 2013
- Petition for review of
- -
- Application number
- 98310071.0
- IPC class
- H01L 21/302
- Language of proceedings
- English
- Distribution
- No distribution (D)
- Download
- Decision in English
- OJ versions
- No OJ links found
- Other decisions for this case
- -
- Abstracts for this decision
- -
- Application title
- Semiconductor wafer processing method
- Applicant name
- Shin-Etsu Handotai Co., Ltd.
- Opponent name
- -
- Board
- 3.4.03
- Headnote
- -
- Relevant legal provisions
- European Patent Convention Art 56 1973
- Keywords
- Inventive step (yes)
- Catchword
- -
- Cited cases
- -
- Citing cases
- -
ORDER
For these reasons it is decided that:
1. The decision under appeal is set aside.
2. The case is remitted to the department of first instance with the order to grant a patent in the following version:
Description:
pages 1, 2, 5, 13-16, 18, 26-29 as originally filed,
page 3, 3A filed at the oral proceedings of 2 October 2007,
page 3B, 4, 17, 33 filed with letter dated 1 October 2013,
pages 6, 11-12, 19, 30, 34 filed with letter dated 23 August 2007,
pages 7-10, 20-25, 31-32 deleted
Claims:
1-6 filed with letter dated 11 September 2013,
Drawings:
figures 1-6 as originally filed,
figures 7-10 deleted.