T 2189/09 of 04.11.2014
- European Case Law Identifier
- ECLI:EP:BA:2014:T218909.20141104
- Date of decision
- 4 November 2014
- Case number
- T 2189/09
- Online on
- 16 January 2015
- Petition for review of
- -
- Application number
- 99307990.4
- IPC class
- H01L 21/60H01L 23/485
- Language of proceedings
- English
- Distribution
- No distribution (D)
- Download
- Decision in English
- OJ versions
- No OJ links found
- Other decisions for this case
- -
- Abstracts for this decision
- -
- Application title
- Semiconductor device comprising bump contacts
- Applicant name
- SHINKO ELECTRIC INDUSTRIES CO. LTD.
- Opponent name
- -
- Board
- 3.4.03
- Headnote
- -
- Relevant legal provisions
- European Patent Convention Art 54 1973European Patent Convention Art 56 1973
- Keywords
- Novelty - main request (yes)
Inventive step - main request (yes) - Catchword
- -
- Cited cases
- -
- Citing cases
- -
Order
For these reasons it is decided that:
1. The decision under appeal is set aside
2. The case is remitted to the department of first instance with the order to grant a patent with the following documents:
Description:
pages 1, 2, 6-12 as originally filed
pages 3, 5 as filed with the letter dated 19 September 2007
page 4 as filed in the oral proceedings before the board.
Claims:
1-3 as filed in the oral proceedings before the board.
Drawings:
Sheets 1/7-7/7 as originally filed