T 0625/95 of 23.05.2000
- European Case Law Identifier
- ECLI:EP:BA:2000:T062595.20000523
- Date of decision
- 23 May 2000
- Case number
- T 0625/95
- Petition for review of
- -
- Application number
- 88111617.2
- IPC class
- H01L 21/18
- Language of proceedings
- English
- Distribution
- Distributed to board chairmen (C)
- Download
- Decision in English
- OJ versions
- No OJ links found
- Other decisions for this case
- -
- Abstracts for this decision
- -
- Application title
- Method for manufacturing bonded semiconductor body
- Applicant name
- KABUSHIKI KAISHA TOSHIBA
- Opponent name
- -
- Board
- 3.4.03
- Headnote
- -
- Relevant legal provisions
- European Patent Convention Art 123(2) 1973European Patent Convention Art 56 1973
- Keywords
- Inventive step - (yes) auxiliary request
Amendement - removal of a feature (not allowed) - Catchword
- -
- Cited cases
- T 0331/87
- Citing cases
- -
ORDER
For these reasons it is decided that:
1. The decision under appeal is set aside.
2. The case is remitted to the first instance with the order to grant the patent on the basis of the following:
Claims:
Nos. 1 to 5 (auxiliary request) as filed during the oral proceedings on 23 May 2000
Description:
Pages 4, 4a, 9, and 10 as filed with the statement of the grounds of appeal on 22. June 1995;
Pages 1 to 3, 5 to 8, as originally filed;
Page 11 as filed during the oral proceedings on 23 May 2000
Drawings: Sheets 1/5 to 5/5 as originally filed.