T 0963/02 (Electromigration/IBM) vom 29.09.2004
- Europäischer Rechtsprechungsidentifikator
- ECLI:EP:BA:2004:T096302.20040929
- Datum der Entscheidung
- 29. September 2004
- Aktenzeichen
- T 0963/02
- Antrag auf Überprüfung von
- -
- Anmeldenummer
- 99301767.2
- IPC-Klasse
- H01L 23/532
- Verfahrenssprache
- Englisch
- Verteilung
- An die Kammervorsitzenden verteilt (C)
- Download
- Entscheidung auf Englisch
- Amtsblattfassungen
- Keine AB-Links gefunden
- Weitere Entscheidungen für diese Akte
- -
- Zusammenfassungen für diese Entscheidung
- -
- Bezeichnung der Anmeldung
- Copper interconnection structure incorporating a metal seed layer
- Name des Antragstellers
- International Business Machines Corporation
- Name des Einsprechenden
- -
- Kammer
- 3.4.03
- Leitsatz
- -
- Relevante Rechtsnormen
- European Patent Convention Art 123(2) 1973European Patent Convention Art 56 1973European Patent Convention Art 84 1973European Patent Convention R 33(2) 1973European Patent Convention R 68(2) 1973
- Schlagwörter
- Inventive step (yes)
Abstract and claim in contradiction to the description in a prior art document - Orientierungssatz
- General and ambiguous disclosure in the abstract and claim of a prior art document construed in the light of the specific embodiments described in the document.
ORDER
For these reasons it is decided that:
1. The decision under appeal is set aside.
2. The case is remitted to the department of the first instance with the order to grant a patent with the following documents:
Claims:
1. to 9 according to the primary request filed with the letter dated 5 July 2004
Description:
pages 1, 2, 3 and 13 as originally filed
pages 4, 7 to 12 and 14 as filed with the letter dated 6 February 2001
pages 5 and 6 filed with the letter dated 2 August 2001
Drawings:
sheets 1/3 to 3/3 as originally filed.