European Patent Office

T 0700/92 (Bonded semiconductor structure/TOSHIBA) of 15.12.1995

European Case Law Identifier
ECLI:EP:BA:1995:T070092.19951215
Date of decision
15 December 1995
Case number
T 0700/92
Online on
18 January 1996
Petition for review of
-
Application number
87309773.7
IPC class
H01L 21/18
Language of proceedings
English
Distribution
Distributed to board chairmen (C)
OJ versions
No OJ links found
Other decisions for this case
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Abstracts for this decision
-
Application title
Method of manufacturing a bonded structure type semiconductor substrate
Applicant name
KABUSHIKI KAISHA TOSHIBA
Opponent name
-
Board
3.4.01
Headnote
-
Keywords
A measure disclosed to be 'conventional' in a prior art document
Conventional measure not an obvious choice
Inventive step - yes (after amendment)
Catchword
-
Cited cases
-
Citing cases
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ORDER

For these reasons it is decided that:

1. The decision under appeal is set aside.

2. The case is remitted to the first instance with the order to prosecute the application further with a view to adapting the description to the subject-matter as claimed in claims 1 to 4 filed with the letter dated 6. January 1995, with the amendment to claim 1 as agreed in the telephone conversation on 23 October 1995, and grant a patent on the basis of these claims.