T 0054/95 of 08.08.1997
- European Case Law Identifier
- ECLI:EP:BA:1997:T005495.19970808
- Date of decision
- 8 August 1997
- Case number
- T 0054/95
- Online on
- 8 August 1997
- Petition for review of
- -
- Application number
- 90107998.8
- IPC class
- H01L 23/485
- Language of proceedings
- English
- Distribution
- Distributed to board chairmen (C)
- Download
- Decision in English
- OJ versions
- No OJ links found
- Other decisions for this case
- -
- Abstracts for this decision
- -
- Application title
- Bonding pad used in semiconductor device
- Applicant name
- Kabushiki Kaisha Toshiba
- Opponent name
- -
- Board
- 3.4.01
- Headnote
- -
- Relevant legal provisions
- European Patent Convention Art 56 1973European Patent Convention Art 84 1973European Patent Convention Art 123(2) 1973
- Keywords
- Disclosure, clarity and inventive step (after amendments: yes)
- Catchword
- -
- Cited cases
- -
- Citing cases
- -
ORDER
For these reasons it is decided that:
1. The decision of the Examining Division is set aside.
2. The case is remitted to the Examining Division with the order to grant a patent on the basis of claims 1 to 6 filed on 17 June 1997, with the description to be adapted accordingly.