T 0438/22 du 23.11.2023
- Identifiant européen de la jurisprudence
- ECLI:EP:BA:2023:T043822.20231123
- Date de la décision
- 23 novembre 2023
- Numéro de l'affaire
- T 0438/22
- Requête en révision de
- -
- Numéro de la demande
- 18211801.8
- Classe de la CIB
- H01L 23/52H01L 25/18H01L 25/065H01L 25/00H01L 25/16H01L 23/522H01L 23/538H01L 23/498
- Langue de la procédure
- Anglais
- Distribution
- Distribuées aux présidents des chambres de recours (C)
- Téléchargement
- Décision en anglais
- Versions JO
- Aucun lien JO trouvé
- Autres décisions pour cet affaire
- -
- Résumés pour cette décision
- Résumé de EPC2000 Art 084
- Titre de la demande
- DISTRIBUTED SEMICONDUCTOR DIE AND PACKAGE ARCHITECTURE
- Nom du demandeur
- INTEL Corporation
- Nom de l'opposant
- -
- Chambre
- 3.4.03
- Sommaire
- -
- Dispositions juridiques pertinentes
- European Patent Convention Art 10(2)(a) (2007)European Patent Convention Art 112(1)(a) (2007)European Patent Convention Art 123(2) (2007)European Patent Convention Art 123(3) (2007)European Patent Convention Art 69(1) (2007)European Patent Convention Art 78 (2007)European Patent Convention Art 82 (2007)European Patent Convention Art 83 (2007)European Patent Convention Art 84 (2007)European Patent Convention Art 94(3) (2007)European Patent Convention Art 97(1) (2007)European Patent Convention R 100(2) (2007)European Patent Convention R 42 (2007)European Patent Convention R 44 (2007)European Patent Convention R 48 (2007)European Patent Convention R 71(1) (2007)Guidelines_F-II 7.4Guidelines_F-IV 4.3Guidelines_F-IV 4.4Guidelines_F-IV 4.4 (version March 2021)RPBA_2020_Art_013(2)_(2020)RPBA_2020_Art_020(2)_(2020)
- Mots-clés
- Claims - main request
Claims - support in the description (no)
Amendment after summons - taken into account (yes)
Late-filed auxiliary request 0 - request clearly allowable (yes)
Referral to the Enlarged Board of Appeal - (no) - Exergue
- 1. There is no provision stipulating that examples within the meaning of Rule 42(1)(e) EPC should not be in the form of claim-like clauses, i.e. in the form of one or more independent clauses followed by a number of clauses referring to previous clauses, at the end of or in another part of the description. There is no justification for deleting such examples just because they were drafted as claim-like clauses.
They are to be treated like any other part of the description and thus, inter alia, must support the claims (Article 84 EPC). (Reasons 3.4 and 3.5)
2. It is a general and overarching objective, and as such also a "requirement" of the Convention, that authorities, courts and the public interpreting the claims at a later stage should, as far as possible, arrive at the same understanding of the claimed subject-matter as the EPO bodies deciding on the patentability of the same subject-matter. The only tool for achieving this objective is the patent specification as the expression of a unitary legal title. The description, as an integral part of the patent specification, should therefore also serve this overriding objective, i.e. it should provide a common understanding and interpretation of the claims. If the description contains subject-matter which manifestly impedes a common understanding, it is legitimate to insist on its removal under Articles 84 and 94(3) EPC and Rules 42, 48 and 71(1) EPC. (Reasons 5.5.3)
3. The board approves the practice where instead of a direct removal, i.e. the deletion of the subject-matter not covered by the claims, a "removal" by way of an appropriate statement is made, leaving the technical disclosure unaffected. (Reasons 5.7.2)
4. A referral to the Enlarged Board of Appeal whose sole purpose is to correct the Guidelines and which is not necessary either for ensuring a uniform case law within the boards or for the board's decision is not admissible. Such a referral could be perceived as an attempt to encroach on the President's powers under Article 10(2)(a) EPC. (Reasons 8.2.2)
Order
For these reasons it is decided that:
1. The request for referral of questions to the Enlarged Board of Appeal is refused.
2. The decision under appeal is set aside.
3. The case is remitted to the examination division with the order to grant a patent in the following version:
Description:
Pages 1 to 28 filed with the letter dated 3 August 2023, under the title of the application "Distributed Semiconductor Die And Package Architecture"
Pages 29 to 38 filed with the letter dated 3 August 2023, under the title of "auxiliary request 0"
Claims: 1 to 15 filed with the grounds of appeal
Drawings: Sheets 1/11 to 11/11 as originally filed