European Patent Office

T 0826/10 of 11.03.2014

European Case Law Identifier
ECLI:EP:BA:2014:T082610.20140311
Date of decision
11 March 2014
Case number
T 0826/10
Petition for review of
-
Application number
98201848.3
Language of proceedings
English
Distribution
No distribution (D)
OJ versions
No OJ links found
Other decisions for this case
-
Abstracts for this decision
-
Application title
Method for controlling solder bump shape and stand-off height
Applicant name
Casantra Acquisition III LLC
Opponent name
-
Board
3.4.03
Headnote
-
Keywords
Inventive step - (yes)
Catchword
-
Cited cases
T 1019/99
Citing cases
-

Order

For these reasons it is decided that:

1. The decision under appeal is set aside.

2. The case is remitted to the Examining Division with the order to grant a patent on the basis of:

- claims 1 to 6 of the main request filed with the letter dated 23 March 2010 stating the grounds of appeal;

- description pages 1, 2, 2a and 3-11 filed with the letter dated 4 February 2014; and

- drawing sheets 1/2 to 2/2, as originally filed.