T 0746/93 of 13.05.1997
- European Case Law Identifier
- ECLI:EP:BA:1997:T074693.19970513
- Date of decision
- 13 May 1997
- Case number
- T 0746/93
- Petition for review of
- -
- Application number
- 87304510.8
- IPC class
- H01L 21/58
- Language of proceedings
- English
- Distribution
- Distributed to board chairmen (C)
- Download
- Decision in English
- OJ versions
- No OJ links found
- Other decisions for this case
- -
- Abstracts for this decision
- -
- Application title
- Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate
- Applicant name
- AT&T Corp.
- Opponent name
- -
- Board
- 3.4.01
- Headnote
- -
- Relevant legal provisions
- European Patent Convention Art 123(2) 1973European Patent Convention Art 56 1973
- Keywords
- Subject-matter extending beyond the content of the application as filed
- Catchword
- -
- Citing cases
- -
ORDER
For these reasons it is decided that:
The appeal is dismissed