T 0488/99 (Bump heights/FUJITSU) of 03.09.2002
- European Case Law Identifier
- ECLI:EP:BA:2002:T048899.20020903
- Date of decision
- 3 September 2002
- Case number
- T 0488/99
- Petition for review of
- -
- Application number
- 94303200.3
- IPC class
- H01L 21/60
- Language of proceedings
- English
- Distribution
- Distributed to board chairmen (C)
- Download
- Decision in English
- OJ versions
- No OJ links found
- Other decisions for this case
- -
- Abstracts for this decision
- -
- Application title
- Process of fabricating semiconductor unit employing bumps to bond two components
- Applicant name
- FUJITSU LIMITED
- Opponent name
- -
- Board
- 3.4.03
- Headnote
- -
- Relevant legal provisions
- European Patent Convention Art 56 1973Guidelines_C-III, 4,2
- Keywords
- Inventive step - main request(no) - auxiliary request(yes)
A narrower interpretation of a term in a claim than its normal meaning - not identified - Catchword
- -
ORDER
For these reasons it is decided:
1. The decision under appeal is set aside.
2. The case is remitted to the examining division with the order to grant a patent with the following documents:
Claims: 1 to 4 of the auxiliary request filed with the statement of the grounds of appeal;
Description: pages 1 to 3, 5 to 11 filed with the letter dated 11 February 1997, page 4 filed during the oral proceedings;
Drawings: Sheets 1/6 to 6/6 as originally filed.