T 0574/21 of 30.08.2021
- European Case Law Identifier
- ECLI:EP:BA:2021:T057421.20210830
- Date of decision
- 30 August 2021
- Case number
- T 0574/21
- Petition for review of
- -
- Application number
- 12185346.9
- Language of proceedings
- English
- Distribution
- No distribution (D)
- Download
- Decision in English
- OJ versions
- No OJ links found
- Other decisions for this case
- -
- Abstracts for this decision
- -
- Application title
- 3d integrated electronic device structure including increased thermal dissipation capabilities
- Applicant name
- Menlo Microsystems, Inc.
- Opponent name
- -
- Board
- 3.4.03
- Headnote
- -
- Relevant legal provisions
- European Patent Convention Art 108 (2007)European Patent Convention R 101(1) (2007)European Patent Convention R 99(2) (2007)
- Keywords
- Admissibility of appeal - missing statement of grounds
- Catchword
- -
- Cited cases
- T 1042/07
- Citing cases
- -
Order
For these reasons it is decided that:
The appeal is rejected as inadmissible.